Nano/Micro Indenter for Electronics
A system that makes everything possible with just one device.
In the electronics industry, the evaluation of the mechanical properties of joints is crucial to ensure the reliability and durability of products. This is especially true for electronic devices that are becoming increasingly miniaturized, where the assessment of the properties of joining materials at the micro level is essential. Improper bonding can lead to performance degradation or failure of the product. NanoVia's nano/micro indenter accurately measures the micro to nano mechanical properties of a wide range of materials, including thin films, coatings, ceramics, and composites, contributing to the quality assessment of joints. 【Application Scenarios】 - Evaluation of bonding strength in electronic components - Reliability assessment of semiconductor packages - Property evaluation of joints between dissimilar materials 【Benefits of Implementation】 - Accurate measurement of the mechanical properties of joints, contributing to product quality improvement - Support for the development of miniaturized devices through micro-level property evaluation - Compatibility with a wide range of materials and various bonding technologies
- Company：アイ・ティー・エス・ジャパン
- Price：Other
